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  S2A-L thru s2m-l 1.5 amp glass passivated silicon rectifier 50 to 1000 volts features high cu r rent capability low forward voltage drop. for surface mount applications high temp soldering: 26 0c for 10 seconds at terminals maximum ratings operating temperature: - 55 c to +15 0 c storage temperat u re: - 5 5 c to +15 0 c typical thermal resistance; 2 0 c/w junction to lead mcc part number device marking maximum recurrent peak reverse voltage maximum rms voltage maximum dc blocking voltage S2A-L s2a 50v 35v 50v s2b-l s2b 100v 70v 100v s2d-l s2d 200v 140v 200v s2g-l s2g 400v 280v 400v s2j-l s2j 600v 420v 600v s2k-l s2k 800v 560v 800v s2m-l s2m 1000v 700v 1000v electrical characteristics @ 2 5 c unless otherwise specified average forward current i f(av) 1.5a t j = 100 c peak forward surge current i fsm 50a 8.3ms, half sine wave maximum instantaneous forward voltage v f 1.15v i fm =1.5a; t j = 2 5 c* maximum dc reverse current at rated dc blocking voltage i r 5. 0 m a 12 5 m a t j = 2 5 c t j = 125 c typical junction capacitance c j 20pf measured at 1.0mhz, v r =4.0v *pulse te s t: pulse width 300 m sec, duty cycle 2%         
 omp onents 2 0736 marilla street chatsworth               !  " #   $
%         !   " #    mcc 0.070? 0.090" 0.085? suggested solder pad layout h j e g a b d c do-214aa (smb) (lead frame) revision: a 2011/01/01 dimensions inches mm dim min max min max note a .075 .095 1.91 2. 41 b .077 .0 8 3 1.96 2. 10 c .002 .008 .05 .20 d ---- - .02 ----- .51 e .0 3 0 .060 .76 1.52 g .2 0 0 .2 2 0 5.08 5.59 h .160 .187 4.06 4.75 j .130 .155 3.30 3.94 tm micro commercial components www. mccsemi .com 1 of 4 ? lead free finish/rohs compliant (note1) ("p"suffix designates compliant. see ordering information) note: 1. high temperature solder exemptions applied, see eu directive annex 7. epoxy meets ul 94 v-0 flammability rating moisture sensitivity level 1
average forward rectified current - amperes versu s figure 2 forward derating curve 0 150 25 50 75 100 0 .3 .6 .9 single phase, half wave 60hz resistive c 125 1.2 1.5 1.8 figure 3 junction capacitance .1 .2 1 .4 2 10 20 40 4 100 200 1 2 6 10 20 100 junction capacitance - pf versus reverse junction potential (applied v + 0.7 volts) - volts pf volts 60 40 4 400 1000 amps instantaneous forward current - amperes versus instantaneous forward voltage - volts figure 1 typical forward c haracteristics 4 6 20 10 amps .4 .6 .8 1.0 1.2 1.4 .01 .02 .04 .06 .1 .2 .4 .6 1 2 25 c volts S2A-L thru s2m-l mcc revision: a 2011/01/01 tm micro commercial components www. mccsemi .com 2 of 4
1 100 4 0 10 20 30 8 figure 4 peak forward surge current peak forward surge current - amperes versus number of cycles at 60hz - c ycles amps cycles 2 6 10 20 60 80 40 40 50 60 figure 5 new sma assembly round lead S2A-L thru s2m-l mcc revision: a 2011/01/01 tm micro commercial components www. mccsemi .com 3 of 4
mcc revision: a 2011/01/01 tm micro commercial components www. mccsemi .com 4 of 4 device packing part number-tp tape&reel: 3kpcs/reel ordering information : *** i m p o r t a n t n o t ic e * ** m i c r o c o m m e r c i a l c o m p on e n ts c o r p . r e s e rve s t h e r i g h t t o m a k e c h a n g e s w i t ho u t f u r t h e r no t i c e t o a n y p r o d u c t h e r e i n t o m a k e c o rr e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m pr o v e m e n t s , o r o t h e r ch a n g e s . m i c r o c o m m e r c i a l c o mp o n e n ts c o r p . d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g ou t o f t h e a p p l i c a t i on o r u s e o f a n y p r o d uc t d e sc r i be d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y li c e n s e un der i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f pr o d uc t s i n s u c h a p p l i c a t i o n s sh a l l a ss u m e a l l r i s k s o f su c h u s e a n d w ill a g r ee t o h o l d m i c r o c o mm er c i a l c o m p o n e n t s c o r p . a n d a ll t h e c o m p a n i e s w ho s e p r o d u c t s a r e r e p r e s e n t ed o n ou r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s. * * * l i f e s u p p o r t *** m c c ' s pr o d uc t s a r e n o t a u t h o r iz ed f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u pp o r t d e v i c e s o r s y s t e m s w i t h ou t t h e e x pre ss wr i tt e n a p p r o v a l o f m i c r o c o mm e r c i a l c o m p o n e n t s c o rp o r a t i o n. * * * c u s t o m e r a w a r e n e ss*** c o un t e r f e i t i n g o f s e m i c o n d u c t o r p a r t s i s a gr o w i n g p r o b l e m i n t h e i n d u s t ry . m i c r o c o mm e r c i a l c o m p o n e n t s ( m cc ) i s t a k i n g s t r o n g m e a su r e s t o p r o t e c t ou r s e l v e s a n d o u r cu s t o m e r s f r o m t h e pr o l i f e r a t i on o f c o u n t e r f e i t p a r t s . m c c s t r o n g l y e nc o u r a g e s c u s t o m e r s t o p u r c h a s e m c c p a r t s e i t h e r d i r e c t l y f r o m m c c o r f r o m a u t ho r i z e d m c c d i s t r i b u t o r s w ho a r e l i s t e d b y c o u n t r y o n o u r w e b p a g e c i t ed below . p r o d uc t s c us t o m e r s b u y e i t h e r f r o m m c c d i r e c t l y o r f r o m a u t ho r i z e d m cc d i s t r i b u t o r s a r e g e n u i n e p a r t s , h a v e f ul l t r a c e a b il i t y , m e e t m c c ' s q u a l i t y s t a n d a r d s f o r h a n d li n g a n d s t o r a g e . m c c wi l l n o t p r o v i d e a n y w a rr a n ty c o v e r a g e o r o t h e r a s s i s t a n c e f o r p a r ts b o u g h t f r o m u n a u t h o r i z e d s o u r c e s. m c c i s c o m m i t t e d t o c o m b a t t h i s g l o b a l pr o b l e m a n d e n c ou r a g e o u r c u s t o m e r s t o d o t h e i r p a r t in s t o p p i n g t h i s p r a c t i c e b y b u y i n g d i r e c t o r f r o m a u t h o r i z ed d i s t r i b u t o r s.


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